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1. W. Sun, H. Liu, W. Gong, L.-M. Peng, and S.-Y. Xu, J. Appl. Phys. 110, 083709 (2011).
2. H. Liu, W. Sun, and S. Xu, Adv. Mater. 24, 3275 (2012).
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5. G. P. Szakmany, Ph.D. dissertation, University of Notre Dame, 2013.
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In a recent article, Sun [J. Appl. Phys. , 083709 (2011)] claim to measure a size-dependent thermoelectric effect in a micron-scale single-metal thermocouple. In this Comment, we demonstrate that the observed phenomenon is not due to a size-dependent Seebeck effect as claimed, but is rather wire-size-dependent heat transport that causes unequal heating at the bonding pads. As a result, the bonding pads are at two different temperatures, and the observed voltage corresponds to a thermoelectric effect of a parasitic thermocouple formed between their metal structure and the bonding-pad wires. We provide simulations and suggest a control experiment based on their structure that supports our contention that the observation depends on width-dependent heat transport in the wires.


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