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/content/aip/journal/jap/115/23/10.1063/1.4884735
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http://aip.metastore.ingenta.com/content/aip/journal/jap/115/23/10.1063/1.4884735
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/content/aip/journal/jap/115/23/10.1063/1.4884735
2014-06-20
2016-12-08

Abstract

In a recent article, Sun [J. Appl. Phys. , 083709 (2011)] claim to measure a size-dependent thermoelectric effect in a micron-scale single-metal thermocouple. In this Comment, we demonstrate that the observed phenomenon is not due to a size-dependent Seebeck effect as claimed, but is rather wire-size-dependent heat transport that causes unequal heating at the bonding pads. As a result, the bonding pads are at two different temperatures, and the observed voltage corresponds to a thermoelectric effect of a parasitic thermocouple formed between their metal structure and the bonding-pad wires. We provide simulations and suggest a control experiment based on their structure that supports our contention that the observation depends on width-dependent heat transport in the wires.

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