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/content/aip/journal/jap/118/17/10.1063/1.4935136
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/content/aip/journal/jap/118/17/10.1063/1.4935136
2015-11-04
2016-09-28

Abstract

Using multi-step deposition mode, we developed an innovational strategy of homogenously multilayered (HM) structure to tailor the roughening kinetics of sputtered W films. Dynamic scaling analysis showed that all sublayers of HM W films exhibited the same anomalous roughening behavior, which originated from the limited surface diffusion. Intriguingly, different from its single-layered counterpart, the HM W films exhibited a suppression effect of kinetic roughening, which could be well manipulated by film modulation period. Detailed experimental characterization and phenomenological model analysis suggested that this roughening suppression arises from the multi-interruption of the continuous film roughening process, forming an interlayer interface after every interruption and restarting the sublayer roughening on the pre-sublayer surface.

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