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Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
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10.1063/1.354305
/content/aip/journal/jap/74/8/10.1063/1.354305
http://aip.metastore.ingenta.com/content/aip/journal/jap/74/8/10.1063/1.354305
/content/aip/journal/jap/74/8/10.1063/1.354305
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/content/aip/journal/jap/74/8/10.1063/1.354305
1993-10-15
2014-07-29
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Microstructure based statistical model of electromigration damage in confined line metallizations in the presence of thermally induced stresses
http://aip.metastore.ingenta.com/content/aip/journal/jap/74/8/10.1063/1.354305
10.1063/1.354305
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