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A study of interlayer coupling in Co/Cu multilayers
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10.1063/1.359561
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    Affiliations:
    1 Center of Materials Analysis and National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People’s Republic of China
    2 Lee Physics Laboratory and Physics Department, Fudan University, Shanghai 200433, China
    3 Center of Materials Analysis and National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People’s Republic of China
    4 Physics Department, Southeast University, Nanjing 210018, People’s Republic of China
    5 Center for Advanced Studies in Science and Technology of Microstructures, Nanjing 210093, People’s Republic of China
    6 Center of Materials Analysis and National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People’s Republic of China
    7 Center of Materials Analysis and National Laboratory of Solid State Microstructures, Nanjing University, Nanjing 210093, People’s Republic of China
    8 Lee Physics Laboratory and Physics Department, Fudan University, Shanghai 200433, People’s Republic of China
    9 Department of Physics, Wayne State University, Detroit, Michigan 48202
    10 Department of Electrical and Computer Engineering, Wayne State University, Detroit, Michigan 48202
    J. Appl. Phys. 77, 3971 (1995); http://dx.doi.org/10.1063/1.359561
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/content/aip/journal/jap/77/8/10.1063/1.359561
1995-04-15
2014-10-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: A study of interlayer coupling in Co/Cu multilayers
http://aip.metastore.ingenta.com/content/aip/journal/jap/77/8/10.1063/1.359561
10.1063/1.359561
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