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Residual stress behavior of thin plasma-enhanced chemical vapor deposited silicon dioxide films as a function of storage time
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10.1063/1.364347
/content/aip/journal/jap/81/7/10.1063/1.364347
http://aip.metastore.ingenta.com/content/aip/journal/jap/81/7/10.1063/1.364347
/content/aip/journal/jap/81/7/10.1063/1.364347
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/content/aip/journal/jap/81/7/10.1063/1.364347
1997-04-01
2014-09-30
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Residual stress behavior of thin plasma-enhanced chemical vapor deposited silicon dioxide films as a function of storage time
http://aip.metastore.ingenta.com/content/aip/journal/jap/81/7/10.1063/1.364347
10.1063/1.364347
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