No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
Effect of hydrogen termination on the work of adhesion between rough polycrystalline silicon surfaces
1.J. N. Israelachvili, Intermolecular and Surface Forces (Academic, London, 1985).
2.A. M. Homola, C. M. Mate, and G. B. Street, MRS Bull. 15, 45 (1990).
3.K. Kendall, 263, 1720 (1994).
4.B. Bhushan, Tribology and Mechanics of Magnetic Storage Devices (Springer, New York, 1990).
5.R. Maboudian and R. T. Howe, J. Vac. Sci. Technol. (to be published). , ().
6.R. T. Howe, J. Vac. Sci. Technol. B 9, 1809 (1988).
7.L. Hornbeck, Proc. SPIE 2782, 2 (1995).
8.R. B. Apte, F. S. A. Sandejas, W. C. Banyai, and D. M. Bloom, in Proceedings of the IEEE Solid-State Sensor and Actuator Workshop–HILTON HEAD ’94, Hilton Head, SC, 1994, p.
9.M.-H. Kiang, O. Solgaard, R. S. Muller, and K. Lau, in Proceedings of the IEEE MEMS, San Diego, CA, 1996, p.
10.N. V. Gitis and L. Volpe, J. Phys. D 25, 605 (1992).
11.In the magnetic recording media industry stiction refers to a system in which friction, due to the presence of strong adhesion, is found to not be proportional to the applied load (Ref. 4). Because applied loads are relatively small compared to adhesive forces at the dimensions of micromechanical devices, the micromachining community has broadened the definition of stiction to refer to virtually all cases of high adhesion between contacting surfaces.
12.R. L. Alley, R. T. Howe, and K. Komvopoulos, in Proceedings of the Solid-State Sensor and Actuator Workshop–HILTON HEAD ’92, Hilton Head, SC, 1992, p.
13.R. Lechtenberg, H. A. C. Tilmans, J. Elders, and M. Elwenspoek, Sens. Actuators A 43, 230 (1994).
14.J. N. Israelachvili, P. McGuiggan, and R. Horn, in Proceedings of the 1st International Symposium Semiconductor Wafer Bonding: Science, Technology and Applications, Phoenix, AZ, 1991, p.
15.W. R. Runyan and K. E. Bean, Semiconductor Integrated Circuit Processing Technology (Addison-Wesley, Reading, MA, 1990).
16.M. R. Houston and R. Maboudian, J. Appl. Phys. 78, 3801 (1995).
17.P. Dumas and Y. J. Chabal, Chem. Phys. Lett. 181, 537 (1991).
18.S.-K. Yand, S. Peter, and C. G. Takoudis, J. Appl. Phys. 76, 4107 (1994).
19.U. Neuwald, H. E. Hessel, A. Feltz, U. Memmert, and R. J. Behm, Surf. Sci. Lett. 296, L8 (1993).
20.M. Niwano, Y. Takeda, Y. Ishibashi, K. Kurita, and N. Miyamoto, J. Appl. Phys. 71, 5646 (1992).
21.C. H. Mastrangelo and C. H. Hsu, in Proceedings of the IEEE Solid-State Sensor and Actuator Workshop—HILTON HEAD ’92, Hilton Head, SC, 1992, p.
22.C. H. Mastrangelo and C. H. Hsu, J. Microelectromechanical Systems 2, 33 (1993).
23.C. H. Mastrangelo and C. H. Hsu, J. Microelectromechanical Systems 2, 44 (1993).
24.M. R. Houston, R. Maboudian, and R. T. Howe, in Proceedings of the 8th International Conference on Solid-State Sensors and Actuators—TRANSDUCERS ’95, Stockholm, Sweden, 1995, p.
25.M. R. Houston, R. Maboudian, and R. T. Howe, in Proceedings of the IEEE Solid-State Sensor and Actuator Workshop—HILTON HEAD ’96, Hilton Head, SC, 1996, p.
26.M. Biebl, G. Brandl, and R. T. Howe, in Proceedings of the 8th International Conference on Solid-State Sensors and Actuators—TRANSDUCERS ’95, Stockholm, Sweden, 1995, p.
27.Q. Meng, M. Mehregany, and R. L. Mullen, J. Microelectromechanical Systems 2, 128 (1993).
28.A pure-methanol rinse could not be used directly after the ammonium fluoride etching step because the ammonium fluoride salt has a low solubility in methanol, and directly mixing the pure 40% ammonium fluoride solution used for etching with pure methanol produced white precipitates that coated the microstructures being released.
29.G. T. Mulhern, D. S. Soane, and R. T. Howe, in Proceedings of the 7th International Conference on Solid-State Sensors and Actuators—TRANSDUCERS ’93, Yokohama, Japan, 1993, p.
30.H. E. Hessel, A. Feltz, M. Reiter, U. Memmert, and R. J. Behm, Chem. Phys. Lett. 186, 275 (1991).
31.W. Kern and D. A. Puotinen, RCA Rev. 30, 187 (1970);
31.W. Kern, J. Electrochem. Soc. 137, 1887 (1990).
32.Unfortunately, the effect of high humidity could not be reliably tested on the hydrophobic surfaces due their rapid oxidation in water and air (see Ref. 21).
33.T. A. Michalske and E. R. Fuller , Jr., J. Am. Ceram. Soc. 68, 586 (1985).
34.A. Ishizaka, S. Iwata, and Y. Kamigaki, Surf. Sci. 84, 355 (1979).
35.A. W. Neumann and R. J. Good, in Surface and Colloid Science Vol. II: Experimental Methods, edited by R. J. Good and R. R. Stromberg (Plenum, New York, 1979).
36.D. Gräf, M. Grundner, R. Schulz, and L. Mühlhoff, J. Appl. Phys. 68, 5155 (1990).
37.J. Kluth and R. Maboudian, J. Appl. Phys. (to be published). , ()
38.Y. L. Chen, C. A. Helm, and J. N. Israelachvili, J. Phys. Chem. 95, 10 736 (1991).
39.R. C Thomas, J. E. Houston, R. M. Crooks, T. Kim, and T. A. Michalske, J. Am. Chem. Soc. 117, 3830 (1995).
40.When microstructure surfaces are dried from water, a phenomenon called solid bridging has been shown to act between contacting surfaces (Ref. 8). The solid bridging is sufficiently strong to adhere all surfaces which come into contact, which in this case would be those surfaces pulled into contact by the surface tension of water.
41.C. Carraro and R. Maboudian (unpublished).
42.H. Krupp, Adv. Coll. Interf. Sci. 1, 111 (1967).
43.G. Vidali, G. Ihm, H.-Y. Kim, and M. W. Cole, Surf. Sci. Rep. 12, 133 (1991).
44.D. Maugis, J. Adhesion Sci. Technol. 10, 161 (1996), and references therein.
45.K. N. G. Fuller and D. Tabor, Proc. R. Soc. London, Ser. A 345, 327 (1975).
46.D. M. Schaefer, M. Carpenter, B. Gady, R. Reifenberger, L. P. Demejo, and D. S. Rimai, J. Adhesion Sci. Technol. 9, 1049 (1995).
Article metrics loading...
Full text loading...
Most read this month
Most cited this month