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Thermal stability of copper silicide passivation layers in copper-based multilevel interconnects
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10.1063/1.367235
/content/aip/journal/jap/83/8/10.1063/1.367235
http://aip.metastore.ingenta.com/content/aip/journal/jap/83/8/10.1063/1.367235
/content/aip/journal/jap/83/8/10.1063/1.367235
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/content/aip/journal/jap/83/8/10.1063/1.367235
1998-04-15
2014-12-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal stability of copper silicide passivation layers in copper-based multilevel interconnects
http://aip.metastore.ingenta.com/content/aip/journal/jap/83/8/10.1063/1.367235
10.1063/1.367235
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