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Determination of the defect depth profile after saw cutting of GaAs wafers measured by positron annihilation
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10.1063/1.368291
/content/aip/journal/jap/84/4/10.1063/1.368291
http://aip.metastore.ingenta.com/content/aip/journal/jap/84/4/10.1063/1.368291
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/content/aip/journal/jap/84/4/10.1063/1.368291
1998-08-15
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Determination of the defect depth profile after saw cutting of GaAs wafers measured by positron annihilation
http://aip.metastore.ingenta.com/content/aip/journal/jap/84/4/10.1063/1.368291
10.1063/1.368291
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