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Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
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10.1063/1.370627
/content/aip/journal/jap/85/12/10.1063/1.370627
http://aip.metastore.ingenta.com/content/aip/journal/jap/85/12/10.1063/1.370627
/content/aip/journal/jap/85/12/10.1063/1.370627
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/content/aip/journal/jap/85/12/10.1063/1.370627
1999-06-15
2014-12-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
http://aip.metastore.ingenta.com/content/aip/journal/jap/85/12/10.1063/1.370627
10.1063/1.370627
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