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On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique
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10.1063/1.1287771
/content/aip/journal/jap/88/5/10.1063/1.1287771
http://aip.metastore.ingenta.com/content/aip/journal/jap/88/5/10.1063/1.1287771
/content/aip/journal/jap/88/5/10.1063/1.1287771
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/content/aip/journal/jap/88/5/10.1063/1.1287771
2000-09-01
2015-03-02
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Scitation: On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique
http://aip.metastore.ingenta.com/content/aip/journal/jap/88/5/10.1063/1.1287771
10.1063/1.1287771
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