No data available.
Please log in to see this content.
You have no subscription access to this content.
No metrics data to plot.
The attempt to load metrics for this article has failed.
The attempt to plot a graph for these metrics has failed.
The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer–Weber thin films
1.R. Abermann and R. Koch, Thin Solid Films 129, 71 (1985).
2.R. Abermann, Vacuum 41, 1279 (1990).
3.D. Winau, R. Koch, A. Fuhrmann, and K. H. Rieder, J. Appl. Phys. 70, 3081 (1991).
4.R. Koch, J. Phys.: Condens. Matter 6, 9519 (1994).
5.A. L. Shull and F. Spaepen, J. Appl. Phys. 80, 6243 (1996).
6.W. D. Nix, Metall. Trans. A 20A, 2217 (1989).
7.W. D. Nix, Scr. Mater. 39, 545 (1998).
8.M. D. Thouless, J. Gupta, and J. M. E. Harper, J. Mater. Res. 8, 1845 (1993).
9.M. D. Thouless, Acta Metall. Mater. 41, 1057 (1993).
10.M. Kobrinsky and C. V. Thompson, Appl. Phys. Lett. 73, 2429 (1998).
11.J. A. Floro, E. Chason, and S. R. Lee, Mater. Res. Soc. Symp. Proc. 406, 491 (1996).
12.J. A. Floro, E. Chason, S. R. Lee, R. D. Twesten, and R. Q. Hwang, J. Electron. Mater. 26, 983 (1997).
13.G. G. Stoney, Proc. Roy. Soc. 82, 172 (1909).
14.P. A. Flinn, D. S. Gardner, and W. D. Nix, IEEE Trans. Electron Devices ED-34, 6 (1987).
15.M. F. Doerner and W. D. Nix, CRC Crit. Rev. Solid State Mater. Sci. 14, 225 (1988).
16.M. D. Thouless, Annu. Rev. Mater. Sci. 25, 69 (1995).
17.R. W. Hoffman, Thin Solid Films 34, 185 (1976).
18.W. D. Nix and B. M. Clemens, J. Mater. Res. 14, 3467 (1999).
19.S. C. Seel, C. V. Thompson, S. J. Hearne, and J. A. Floro, J. Appl. Phys. (in press).
20.L. B. Freund (private communication).
21.R. C. Cammarata, Prog. Surf. Sci. 46, 1 (1994).
22.R. C. Cammarata, T. M. Trimble, and D. J. Srolovitz, J. Mater. Res. 15, 2468 (2000).
23.Defining a single critical size is somewhat artificial, but theoretically convenient.
24.Equation (3) can be obtained from Eq. (7) in Ref. 22 by assuming that the cylindrical islands have a fixed aspect ratio A, and that the cylinder-edge term is small compared to the cylinder-face terms.
25.C. V. Thompson, J. Mater. Res. 14, 3164 (1999).
26.F. Spaepen, J. Mech. Phys. Solids 44, 675 (1996).
27.F. Spaepen, Acta Mater. 48, 31 (2000).
28.Spaepen’s derivation for the curvature imposed by a drop assumes that the drop size is larger than the substrate thickness, which does not seem to be a case relevant to most thin films.
29.G. Thurner and R. Abermann, Thin Solid Films 192, 277 (1990).
30.Deposition of Ag and Ti films near −100 °C leads only to tensile stress rather than increased compression. J. A. Floro, S. J. Hearne, J. A. Hunter, P. Kotula, E. Chason, S. C. Seel and C. V. Thompson (unpublished).
31.P. Chaudhari, J. Vac. Sci. Technol. 9, 520 (1972).
32.J. A. Floro, C. V. Thompson, R. Carel, and P. D. Bristowe, J. Mater. Res. 9, 2411 (1994).
33.E. M. Zielinski, R. P. Vinci, and J. C. Bravman, Appl. Phys. Lett. 67, 1078 (1995).
34.E. M. Zielinski, R. P. Vinci, and J. C. Bravman, J. Appl. Phys. 76, 4516 (1994).
35.J. E. Sanchez and E. Arzt, Scr. Metall. Mater. 27, 285 (1992).
36.J. A. Floro, M. B. Sinclair, E. Chason, L. B. Freund, R. D. Twesten, R. Q. Hwang, and G. A. Lucadamo, Phys. Rev. Lett. 84, 701 (2000).
37.F. Family and P. Meakin, Phys. Rev. Lett. 61, 428 (1988).
38.H. Gao, L. Zhang, W. D. Nix, C. V. Thompson, and E. Arzt, Acta Mater. 47, 2865 (1999).
39.D. N. Dunn, R. Hull, F. M. Ross, R. M. Tromp, J. Appl. Phys. (submitted).
40.M. Poppeler and R. Abermann, Thin Solid Films 60, 295 (1997).
41.H. J. SchneeweiSchneeweiß and R. Abermann, Vacuum 43, 463 (1992).
42.The studs were epoxy bonded to the films and cured at 150 °C, so that the adhesion is not necessarily characteristic of the as-deposited films at room temperature. However, we believe that the conclusion that has a much higher interfacial strength than is still strongly supported by the pull test results.
Article metrics loading...
Full text loading...
Most read this month
Most cited this month