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Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions
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10.1063/1.1380219
/content/aip/journal/jap/90/3/10.1063/1.1380219
http://aip.metastore.ingenta.com/content/aip/journal/jap/90/3/10.1063/1.1380219
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/content/aip/journal/jap/90/3/10.1063/1.1380219
2001-08-01
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electromigration effect upon the Sn–0.7 wt% Cu/Ni and Sn–3.5 wt% Ag/Ni interfacial reactions
http://aip.metastore.ingenta.com/content/aip/journal/jap/90/3/10.1063/1.1380219
10.1063/1.1380219
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