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Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films
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10.1063/1.1487907
/content/aip/journal/jap/92/3/10.1063/1.1487907
http://aip.metastore.ingenta.com/content/aip/journal/jap/92/3/10.1063/1.1487907
/content/aip/journal/jap/92/3/10.1063/1.1487907
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/content/aip/journal/jap/92/3/10.1063/1.1487907
2002-07-18
2014-10-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Factors affecting an efficient sealing of porous low-k dielectrics by physical vapor deposition Ta(N) thin films
http://aip.metastore.ingenta.com/content/aip/journal/jap/92/3/10.1063/1.1487907
10.1063/1.1487907
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