(a) Schematic illustration of the geometry of a CB laser soldered onto a heat sink. A wide SC-device, as a segment of a CB, is marked (left). Device-specific axes are illustrated, with along the 110 direction. (b) Schematic of a setup that serves for application of a uniaxial stress in the 110-direction. (c) Schematic diagram of a setup that serves for application of biaxially-symmetric, in-plane strain to SC-device. If the cylindrical Piezo device, on top of which the device is fixed by conductive epoxy, expands longitudinally (dotted cylinder) the stop surface and, hence, the SC-device, is compressed biaxially.
Transition energy shifts as a function of packaging-induced strain along the 110-direction for the case of zero intrinsic strain. A linear fit is reasonable for packaging-induced strain values of up to about 0.20%, and different slopes must be used for compressive and tensile packaging-induced strain. transition, compression, squares; transition, compression, triangles; transition, tension, diamonds; transition, tension, circles.
Energy shift per strain coefficients for QW interband transitions as a function of packaging-induced strain. The coefficients are defined as the shift in energy per packaging-induced strain along 110-direction, or axis. (a) Energy shift coefficients for compressive, packaging-induced strain. transition, squares; transition, circles. (b) Energy shift coefficients for tensile, packaging-induced strain. transition, squares; transition, circles.
Spectral position of the transition (a) and the transition (b) versus induced strain in the 110-direction. The open and closed circles refer to different experiments with different devices (reproducibility test). The lines correspond to different model calculations. The three models are: (1) no QCSE, solid line; (2) QCSE included, dashed line; (3) QCSE with shielding included, dotted line. The shielding factor is 0.302.
—coefficient for the transition as a function of induced strain along the 110-direction, extracted from the data in Fig. 4(b). The heavy solid line is the best fit to the data. The other lines refer to different model calculations: no QCSE, solid line; QCSE included, dashed line; QCSE with shielding included, dotted line. The strain range of interest for packaging-induced strain is 0.0% to .
Shift of the spectral positions of the transition (open circles) and transition (full circles) versus the magnitude of the in-plane, biaxially symmetric strain for a SC-device waveguide. The in-plane strain is compressive. The lines correspond to the theoretical results for the transition (dashed) and the transition (solid).
Emission energy of a SC device versus induced, compressive, hydrostatic strain (circles). The solid line is the theoretical prediction for hydrostatic strain in this case.
The spectral positions of the (a) and transitions (b) as a function of position along two CBs from the same batch. One CB is soldered onto a copper heat sink (fill squares or circles), and the other onto a diamond heat spreader (open squares or circles). The maximum shift in energy from the unstrained energy is the bowing factor .
Applied stress along  with biaxially symmetric, in-plane intrinsic strain .
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