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Increase of the thermoelectric power factor in , and composite materials
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10.1063/1.1895468
/content/aip/journal/jap/97/10/10.1063/1.1895468
http://aip.metastore.ingenta.com/content/aip/journal/jap/97/10/10.1063/1.1895468

Figures

Image of FIG. 1.
FIG. 1.

Composite thermoelectric device (CTD) with a sandwich structure in which a disk of thermoelectric material is sandwiched between two cylinders of materials and . The direction of the temperature gradient is along the cylindrical axis of the device.

Image of FIG. 2.
FIG. 2.

Fabrication method of composite devices welded with Bi.

Image of FIG. 3.
FIG. 3.

Photographs of a welded thermoelectric device (a) and two boundaries welded with Bi (b).

Image of FIG. 4.
FIG. 4.

Resultants and as a function of for welded devices composed of (a), (b), and (c). The solid and dashed curves denote and calculated from Eqs. (1) and (7), respectively, using the experimental values, as listed in Table I. The dotted curves are obtained by multiplying the dashed curves by a factor of , so that reproduces well the observed values.

Image of FIG. 5.
FIG. 5.

Resultant as a function of for welded devices composed of (a), (b), and (c). The solid curves denote values calculated from Eq. (8), using the experimental values, as listed in Table I. The dashed curves for deices (a)–(c) are calculated using and other thermoelectric properties of component materials, where a value of was used for device (a) alone.

Tables

Generic image for table
Table I.

Electrical resistivities and Seebeck coefficients measured at 298 K for pure cylindrical rods of Cu, Ni, and Bi with a length of 20 mm and a diameter of 5 mm.

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/content/aip/journal/jap/97/10/10.1063/1.1895468
2005-05-13
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Increase of the thermoelectric power factor in Cu∕Bi∕Cu,Ni∕Bi∕Ni, and Cu∕Bi∕Ni composite materials
http://aip.metastore.ingenta.com/content/aip/journal/jap/97/10/10.1063/1.1895468
10.1063/1.1895468
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