Schematic representation of two-phase planar and regular lamellar coupled eutectic growth during unidirectional solidification showing the solid-liquid interface growing ahead of the two phases ( and ) with a growth velocity .
Schematic representation of an isothermal section in a hypothetical ternary eutectic phase diagram showing the eutectic valleys (dotted) arriving in the ternary eutectic point , the original alloy composition , and the univariant tie-triangle indicating the composition of the solid phases and and the composition of the univariant eutectic liquid .
Schematic drawing of the lamellar eutectic interface showing the definition of the contact angles and .
Liquidus projection (see Refs. 17 and 23) of the Al–Cu–Ag ternary system indicating the investigated univariant eutectic reaction .
Interlamellar spacing as function of the inverse square root of the growth rate ; the points represent experimental data (see Ref. 17), the dotted lines represent the respective experimental data fit to a relationship, and the solid lines represent the corresponding calculated values for the two investigated Al–Cu–Ag alloys: (a) and (b) .
Absolute values and relative change of the value as function of volume fraction calculated for the two investigated Al–Cu–Ag alloys.
Sensitivity analysis of the constant with respect to the material property data. The horizontal axis represents the cases of a or change for the different relevant material properties in the case of the two investigated alloys.
Summary of simulation data available to calculate two-phase planar and lamellar eutectic growth in and .
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