A schematic illustration of an interconnect and the active stress relaxation volume.
Void volume vs time through solutions Eqs. (9), (13), and (14) for three stages: SIV plate, SIV long line, and SIV short line.
Void volume vs time through solution Eq. (15).
Void volume vs time for interconnects of four different dimensions.
Void volume vs time for two interconnects with different effective modulus.
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