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A physically based lifetime model for stress-induced voiding in interconnects
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10.1063/1.1922072
/content/aip/journal/jap/97/11/10.1063/1.1922072
http://aip.metastore.ingenta.com/content/aip/journal/jap/97/11/10.1063/1.1922072
/content/aip/journal/jap/97/11/10.1063/1.1922072
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/content/aip/journal/jap/97/11/10.1063/1.1922072
2005-05-23
2014-10-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: A physically based lifetime model for stress-induced voiding in interconnects
http://aip.metastore.ingenta.com/content/aip/journal/jap/97/11/10.1063/1.1922072
10.1063/1.1922072
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