(a) A slurry drop formed by wet SiC granules of size 100 μm. (b) A mouldable material formed by wet SiC nanogranules of size 20 nm. The solvent is EG.
Two types of solvents are considered. The EG drop remains on the surface of SiC granules of 10 μm for a few minutes, while n-decane impregnates SiC granules easily. Therefore, EG is solvophobic for SiC and decane is solvophilic.
The effect of solvent, including (a) EG, (b) decane, and (c) EG+DDA on the behavior of wet granular and nanogranular materials. DDA is a nonionic surfactant.
Wet granular and nanogranular materials atop a small hole. (a) and (b) Liquidlike (flowing down). (c) and (d) Solidlike (motionless).
The variation of dynamic moduli G ′ and G ″ with oscillation frequency ω for SiC nanogranules in different solvents. The behavior of wet granules is given in the inset.
The variation of the shear stress with the shear rate for nanogranules in various solvents. The yield stress is obtained at low shear rate and the inverted-tube test is shown.
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