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Electron bunching from a dc-biased, single-surface multipactor with realistically broad energy spectrum and emission angle of secondary electrons
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10.1063/1.3685697
/content/aip/journal/pop/19/2/10.1063/1.3685697
http://aip.metastore.ingenta.com/content/aip/journal/pop/19/2/10.1063/1.3685697
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

The structure of the multipactor. Lower plates are surface which the electrons hit.

Image of FIG. 2.
FIG. 2.

The diagram of the distribution which follows and is uniformly distributed in 0–2π.

Image of FIG. 3.
FIG. 3.

Comparison of normalized velocity spectra between MC method and numerical iteration in artifical materials where the parameters are (a) and (b) . The dotted and solid lines overlap quite exactly on the dotted-dashed and dashed lines, respectively, so they are not that distinguishable.

Image of FIG. 4.
FIG. 4.

(Color online) The current diagram of normal direction at the surface of material where the parameter of material is . We measured the full width of I max/e.

Image of FIG. 5.
FIG. 5.

(Color online) The diagram represented energy spread of secondary electron with angular effect, comparing with simulation results and mapping function, where the parameters are (a) and (b) without angular effect and (c) and (d) with effective angular effect.

Image of FIG. 6.
FIG. 6.

Comparison of normalized velocity spectra between MC method and numerical iteration in copper case.

Image of FIG. 7.
FIG. 7.

PIC simulation of area of electron at the copper surface where is varied.

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/content/aip/journal/pop/19/2/10.1063/1.3685697
2012-02-22
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Electron bunching from a dc-biased, single-surface multipactor with realistically broad energy spectrum and emission angle of secondary electrons
http://aip.metastore.ingenta.com/content/aip/journal/pop/19/2/10.1063/1.3685697
10.1063/1.3685697
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