Schematic representation of the microscopic four-point probe ; upper right: four-point measurement principle; -to-probe spacing.
Fabrication of the : (a) KOH etch of tip molds; (b) wet oxidation and poly-Si deposition, metal layer patterned by Cl dry etch; (c) -thick SU-8 layer for cantilevers; (d) -thick SU-8 layer for body chip; (e) release etch with .
SEM micrographies of with probe-to-probe spacing . (a) Body chip with cantilever (all SU-8) and with four contact electrodes in metal; (b) SU-8 cantilever split up in four microcantilevers; (c) details of the pyramidal probe tips (SU-8 covered by metal layer) at the extremity of the cantilevers; tip height .
4PP resistivity measurement on -thick Au film; currents of were applied and the four-point voltages were measured; the resulting mean sheet resistance is comparable to the value measured with the macroscopic resistivity meter Omnimap RS75 at a current of .
Four-point measurement on -thick pentacene film; a current sweep up to with a step of was performed; the resulting mean value of sheet resistance is .
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