FIB system with a cryogenic measurement setup installed inside. The helium transfer tube connecting liquid helium feedthrough and liquid helium Dewar is not shown in this figure.
Configuration of the cryogenic measurement setup inside the FIB system: (a) schematic view and (b) photograph of the system (shown without the Mylar shield for clarity).
Layout design of an integrated temperature sensor located in the center of a test chip. The area of the integrated temperature sensor is .
Schematic view of the copper block for calibration of the integrated temperature sensor.
Resistance-temperature curve of the integrated temperature sensor.
Equivalent thermal model of the cryogenic measurement setup. Thermal capacity and temperature of each component are given at cryogenic temperatures. represents thermal resistance.
Schematic diagram of the mechanism for the resonant test.
SEM picture of a T-shaped cantilever with a 52° titled angle at its first resonant mode.
Bending test of a T-shaped cantilever. The large blade of the cantilever is pushed by the microneedle until fracture.
Schematic cross section of a single shutter element: (a) at close state, and (b) at open state.
Microrepair for blocking test of a microshutter array: (a) The microneedle is placed to contact a membrane utilized to block a broken shutter element. Ion-induced platinum deposition is then performed to weld the microneedle with the membrane. (b) The microneedle with the membrane is released by ion milling the connecting part of the membrane to the substrate. (c) Transport the membrane to the position of the broken shutter element. (d) The membrane is welded with the broken shutter window using platinum deposition. Finally, the microneedle is released from the membrane by ion milling.
SEM pictures of a microshutter array at (a) and (b) . The surface of the shutter element curls up at due to the mismatch of the coefficients of thermal expansion of the structural layers.
SEM picture of a microshutter element with a curl-down surface at room temperature.
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