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Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling
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10.1063/1.2165567
/content/aip/journal/rsi/77/2/10.1063/1.2165567
http://aip.metastore.ingenta.com/content/aip/journal/rsi/77/2/10.1063/1.2165567
/content/aip/journal/rsi/77/2/10.1063/1.2165567
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/content/aip/journal/rsi/77/2/10.1063/1.2165567
2006-02-09
2014-09-01
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling
http://aip.metastore.ingenta.com/content/aip/journal/rsi/77/2/10.1063/1.2165567
10.1063/1.2165567
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