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Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling
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10.1063/1.2165567
/content/aip/journal/rsi/77/2/10.1063/1.2165567
http://aip.metastore.ingenta.com/content/aip/journal/rsi/77/2/10.1063/1.2165567

Figures

Image of FIG. 1.
FIG. 1.

SEM micrograph of AlN specimen.

Image of FIG. 2.
FIG. 2.

The schematic diagram of measuring equipment. (1) Loading spring; (2) contact interface layer; (3) NiCr–CuFe thermocouple; (4) second-stage cold head; (5) supporting element; (6) AlN specimen; (7) OFHC specimen; (8) heater; (9) second-stage cold shielding; (10) loading screw; (11) and (18) vacuum gauge; (12) first-stage cold shielding; (13) vacuum container; (14) valve; (15) GM cryocooler; (16) computer; and (17) 2700 multichannel data acquisition.

Image of FIG. 3.
FIG. 3.

Circuit diagram of measuring system. (1) Heater of specimens; (2) heater of second cold shielding; (3) and (7) regulating resistance; (4) and (5) power supply; (6) and (8) standard resistance; (9) NiCr–CuFe thermocouple; (10) temperature reference point—freezing point of pure water; (11) Keithly-2700 data-acquisition unit; and (12) computer.

Image of FIG. 4.
FIG. 4.

Variation of thermal conductivity of AlN with temperature.

Image of FIG. 5.
FIG. 5.

Thermal conductivity of AlN single crystal measured by Slack and Tanzilli.

Image of FIG. 6.
FIG. 6.

Variation of TCC with temperature between AlN and OFHC.

Image of FIG. 7.
FIG. 7.

Variation of TCC with pressure load between AlN and OFHC.

Image of FIG. 8.
FIG. 8.

Variation of TCC with temperature between AlN and Bi2223.

Tables

Generic image for table
Table I.

Roughness and flatness of end surfaces on specimens.

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/content/aip/journal/rsi/77/2/10.1063/1.2165567
2006-02-09
2014-04-24
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Thermal contact conductance of ceramic AlN and oxygen-free high-conductivity copper interfaces under low temperature and vacuum for high-temperature superconducting cryocooler cooling
http://aip.metastore.ingenta.com/content/aip/journal/rsi/77/2/10.1063/1.2165567
10.1063/1.2165567
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