(a) Schematic of a chip containing a Boersch phase plate, Au leads, and a macroscopic Au contact pad. (b) Zoom into the phase plate region on the freestanding membrane (in black). (c) Three-dimensional sketch of the central region of the phase plate.
SEM images illustrating the different steps of the fabrication process of the Boersch phase plate. (a) After electron-beam lithography, Au evaporation, and lift-off. (b) After the first FIB lithography step. [(c) and (d)] Finished phase plate. (d) Close-up view of the ring electrode hole.
Power spectra obtained from images of an amorphous W film observed in the TEM at a primary magnification of for two different voltages, (lower half) and (upper half). For the Thon rings are uniformly shifted, indicating a uniform phase shift of between scattered and unscattered electrons.
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