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Schematic illustrations of the fabrication steps of the MLL.
SEM image of the damage generated during the dicing process.
SEM images taken from multilayer cross sections produced by [(a) and (b)] mechanical polishing and [(c) and (d)] mechanical polishing, ion-beam polishing, and final manual polishing. The images in (b) and (d) show a side edge, while those in (a) and (c) show a region away from the edge. A distorted region in (a) is indicated by an arrow. The arrows in (b) and (d) indicate bent layers that are generated during side polishing. After the procedure including ion-beam polishing, the entire cross-sectioned surface is damage-free except within of the sides.
(a) Schematic illustration of a wedge sample used for x-ray diffraction and focusing measurements. A typical wedge has section depths ranging from that are optimum for x-ray energies from . (b) A typical rocking curve at the first order diffraction peak in the transmission Laue geometry. From the period of the interference fringes, , one can obtain the section depth as .
Dicing blade type and system parameters used for cutting a MLL.
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