Schematic illustration of Ar-ion beam irradiation to a sample with an initial thickness of in ion slicer. (Left) Argon ion source and the sample holder rocks ±6.0° and ±30°, respectively. (Right) A side view of the specimen block.
Schematic illustrations of the procedures before ion milling. (a) A sample retrieved from a DAC experiment is detached together with a Re foil gasket. (b) It is then placed on a Si wafer. The specimen block is thinned to thick and mounted under a shield belt in Ion Slicer. (c) An image taken by CCD camera in the ion slicer.
Procedures of milling with ion slicer. (a) First milling; the sample block is thinned to thickness identical with that of a shield belt. (b) Second milling; the shield belt is removed, and the specimen block is placed upside down. The time passed since the beginning of milling is shown.
TEM image of a thin film of mixed with platinum served as laser absorber. Note the almost uniform thickness over a wide area.
TEM image of recovered from 110 GPa and 2000 K. The thin film shows the entire cross section of a DAC sample along the compression axis.
(a) Back scattered electron image and (b) corresponding thickness map of a recovered DAC sample obtained by a FE-EPMA and representative thickness assuming the density to be . This sample is a natural basaltic rock and a small amount of Iridium metal at the edge of the film. Thin region with the thickness below 100 nm has dimensions of .
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