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In situ positioning of a few hundred micrometer-sized cleaved surfaces for soft-x-ray angle-resolved photoemission spectroscopy by use of an optical microscope
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10.1063/1.3124145
/content/aip/journal/rsi/80/5/10.1063/1.3124145
http://aip.metastore.ingenta.com/content/aip/journal/rsi/80/5/10.1063/1.3124145
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

A schematic top view of the ARPES system with the long-working-distance optical microscope.

Image of FIG. 2.
FIG. 2.

(a) Microscope view of the copper plate surface with vertical and horizontal scratch lines. The white lines and circles are the marks on the microscope monitor. The cross point of the white lines indicates the position where a target should be placed. The diameters of the smaller and larger circles correspond to 100 and , respectively. (b) The observed fluorescence spot on the copper plate surface covered with the phosphor powders. The copper plate was shifted parallel to its surface from the position in (a) to the phosphor area.

Image of FIG. 3.
FIG. 3.

(a) A Si(100) wafer chip used for the ARPES measurement. (b) The Si wafer chip mounted on a sample carrier. (c) View of the cleaved Si wafer in the analyzer chamber observed by the optical microscope. (d) The band dispersions of Si along the direction observed for the cleaved region.

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/content/aip/journal/rsi/80/5/10.1063/1.3124145
2009-05-01
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: In situ positioning of a few hundred micrometer-sized cleaved surfaces for soft-x-ray angle-resolved photoemission spectroscopy by use of an optical microscope
http://aip.metastore.ingenta.com/content/aip/journal/rsi/80/5/10.1063/1.3124145
10.1063/1.3124145
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