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Atom chips on direct bonded copper substrates
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10.1063/1.3529434
/content/aip/journal/rsi/82/2/10.1063/1.3529434
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/2/10.1063/1.3529434
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

A scanning electron micrograph of the top view of test chip A.

Image of FIG. 2.
FIG. 2.

A scanning electron micrograph of the cross sectional view of test chip A.

Image of FIG. 3.
FIG. 3.

A scanning electron micrograph of the top view of test chip B.

Image of FIG. 4.
FIG. 4.

A scanning electron micrograph of the cross sectional view of test chip B.

Image of FIG. 5.
FIG. 5.

(Color online) Toner masks for etching the front (a) and back (c) chips and photographs of the etched DBC atom chips of front (b) and back (d) chips.

Image of FIG. 6.
FIG. 6.

(Color online) Photograph of DBC atom chip assembly on copper mounting post.

Image of FIG. 7.
FIG. 7.

The optimal aspect ration α as a function of the ratio of trap height to wire thickness ζ.

Image of FIG. 8.
FIG. 8.

The maximum value of the dimensionless magnetic field gradient β as a function of the ratio of trap height to wire thickness ζ.

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/content/aip/journal/rsi/82/2/10.1063/1.3529434
2011-02-10
2014-04-25
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Atom chips on direct bonded copper substrates
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/2/10.1063/1.3529434
10.1063/1.3529434
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