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A noncontact thermal microprobe for local thermal conductivity measurement
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10.1063/1.3545823
/content/aip/journal/rsi/82/2/10.1063/1.3545823
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/2/10.1063/1.3545823
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Figures

Image of FIG. 1.
FIG. 1.

(a) Schematic sketches of the thermal microprobe illustrating the heat transfer pathways between the microprobe tip and the sample in contact and noncontact modes. T s and T 0 are the temperatures of the tip, the sample surface, and the ambient, respectively. b is the thermal contact radius and h indicates convection heat transfer. The figures are not to scale. (b) Effective microprobe thermal resistances R eff measured as a function of tip–sample distance d t–s on a glass substrate and a reference bismuth telluride alloy pellet. Negative numbers of d t–s indicate the cantilever deflecting after solid contact at d t–s = 0.

Image of FIG. 2.
FIG. 2.

An example of the temperature rise profile along half of the microprobe (solid line) calculated using the heat transfer model and G c and b determined for the noncontact mode. Also shown are the temperature rise of the probe tip ΔT tip, the sample surface ΔT s, and the average temperature rise of the microprobe ΔT probe (dashed line).

Image of FIG. 3.
FIG. 3.

Microprobe temperature rise ΔT probe vs input electrical power P (dots) measured with d t–s = ∼50 nm on Bi2Te3 and Bi2Se3 films and nanostructured bulk pellets of Bi2Te3 and Sb2Te3 by our noncontact quasiballistic microprobe technique. The model fits with different slopes dΔT probe/dP = R eff indicate different sample thermal conductivities. The top inset is a cross sectional scanning electron micrograph of the nanoporous Bi2Te3 film assembly. The bottom inset is a cross sectional transmission electron micrograph capturing the plate-shaped grains in a nanostructured Bi2Te3 pellet.

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/content/aip/journal/rsi/82/2/10.1063/1.3545823
2011-02-17
2014-04-21
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: A noncontact thermal microprobe for local thermal conductivity measurement
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/2/10.1063/1.3545823
10.1063/1.3545823
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