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Novel plasma immersion ion implantation and deposition hardware and technique based on high power pulsed magnetron discharge
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10.1063/1.3565175
/content/aip/journal/rsi/82/3/10.1063/1.3565175
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/3/10.1063/1.3565175
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic diagram of the HPPMS-PIII&D system.

Image of FIG. 2.
FIG. 2.

Three different work modes in HPPMS-PIII&D: (a) Target voltage (T voltage) and target current (T current), (b) high voltage and substrate current (S current) in mode A: pure implantation, (c) HV and S current in mode B: simultaneous implantation and deposition, and (d) HV and S current in mode C: selective implantation.

Image of FIG. 3.
FIG. 3.

Substrate currents for different HV pulse amplitudes in the (a) pure implantation mode, (b) simultaneous implantation and deposition, and (c) selective implantation of HPPMS-PIII&D and dc magnetron discharge using the same power.

Image of FIG. 4.
FIG. 4.

SEM micrographs of the CrN films on Si(100) substrates with the simultaneous implantation and deposition modes using (a) HPPMS source and (b) CA source.

Image of FIG. 5.
FIG. 5.

Cross-sectional SEM of the CrN films deposited on Si(100) substrates with different work modes: (a) pure implantation mode, (b) simultaneous implantation and deposition, and (c) selective implantation.

Image of FIG. 6.
FIG. 6.

Micrographs obtained from the scratches on the CrN films deposited on stainless steels with different work modes: (a) pure implantation mode, (b) simultaneous implantation and deposition, and (c) selective implantation.

Image of FIG. 7.
FIG. 7.

Hardness and Young's modulus of the CrN films deposited on stainless steels with different work modes: (a) pure implantation mode, (b) simultaneous implantation and deposition, and (c) selective implantation.

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/content/aip/journal/rsi/82/3/10.1063/1.3565175
2011-03-24
2014-04-16
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Novel plasma immersion ion implantation and deposition hardware and technique based on high power pulsed magnetron discharge
http://aip.metastore.ingenta.com/content/aip/journal/rsi/82/3/10.1063/1.3565175
10.1063/1.3565175
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