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High-pressure resistivity technique for quasi-hydrostatic compression experiments
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10.1063/1.4809025
/content/aip/journal/rsi/84/6/10.1063/1.4809025
http://aip.metastore.ingenta.com/content/aip/journal/rsi/84/6/10.1063/1.4809025
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Anvils with the electrical probes assembly. (a) The flat diamond culet with the FIB probes before the attachment of the sample. (b) The same diamond with the sample attached. The inset shows one probe running over the edge of the crystal sample. (c) The Pt metal leads inside the indented BN that will carry the signal from the sample to FIB electric probes further to the electronics. (d) Picture showing the culet, after the DAC was closed, with the attached sample and FIB probes in contact with the outer Pt-foil leads.

Image of FIG. 2.
FIG. 2.

Schematic drawing of the loaded resistivity DAC setup.

Image of FIG. 3.
FIG. 3.

Typical DAC high pressure resistivity data of PrCeCuO in upper panel and BiSrCuO in lower panel. Adapted from Rotundu and Ćuk , respectively.

Image of FIG. 4.
FIG. 4.

Beveled diamonds with FIB lithographic electrical contacts for multimegabar DAC resistivity measurements.

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/content/aip/journal/rsi/84/6/10.1063/1.4809025
2013-06-10
2014-04-17
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: High-pressure resistivity technique for quasi-hydrostatic compression experiments
http://aip.metastore.ingenta.com/content/aip/journal/rsi/84/6/10.1063/1.4809025
10.1063/1.4809025
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