Integrated Stamping Simulation Using State Of The Art Techniques To Fulfill Quality Assessment Requirements
- Conference date: 15-19 August 2005
- Location: Detroit, Michigan (USA)
The last few years have seen the use of stamping simulation evolve to the extent that it is now a mainstream activity; a core part of the press tool engineering process. Now, new requirements for the use of challenging materials like Dual phase / Complex phase steel, VHSS, and aluminum, together with more stringent quality expectations, and shorter development cycles, there is a need to assess the panel quality in a wider context, before committing to tool manufacture.
The integrated approach from ESI Group allows early up‐front feasibility assessment, geometry and process optimization, and detailed process validation all within one system. Rapid die design and quick forming simulation modules play an essential role in the early stages of the process. A seamless connection between simulation and geometry is a vital characteristic, with the accurate simulation being used to validate and fine tune the process in order to assess final component quality in unprecedented detail, utilizing some of the most accurate material models available today. The combination of the distributed memory processing (DMP) solver together with new cost effective cluster based compute servers provide a practical solution to the problems of ‘one million element’ model sizes, and more sophisticated modeling methodologies become realistic for the first time.
It is no longer sufficient to merely focus on the draw die, forming simulation must now consider the entire die line up. Typically, around half of forming issues arise from the draw die, so the time has now come to address the other half as well!
This paper will discuss how the PAM‐STAMP 2G™ integrated solution is successfully used to deliver a positive business impact, by providing virtual panel quality assessment, tolerance control, and springback compensation. The paper will also discuss how other forming processes can be accurately modeled using the new modules.
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