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Evaluation of Package Stress during Temperature Cycling using Metal Deformation Measurement and FEM Simulation
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/content/aip/proceeding/aipcp/10.1063/1.2173543
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.2173543
/content/aip/proceeding/aipcp/10.1063/1.2173543
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/content/aip/proceeding/aipcp/10.1063/1.2173543
2006-02-07
2016-05-04

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