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Residual Stresses in Ta, Mo, Al and Pd Thin Films Deposited by E‐Beam Evaporation Process on Si and Si/SiO2 Substrates
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10.1063/1.2173565
/content/aip/proceeding/aipcp/10.1063/1.2173565
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.2173565
/content/aip/proceeding/aipcp/10.1063/1.2173565
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/content/aip/proceeding/aipcp/10.1063/1.2173565
2006-02-07
2014-11-28
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229c8a00d8fe88cf152414eb5d9cd803 conferences.conference_paperzxybnytfddd
Scitation: Residual Stresses in Ta, Mo, Al and Pd Thin Films Deposited by E‐Beam Evaporation Process on Si and Si/SiO2 Substrates
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.2173565
10.1063/1.2173565
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