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Residual Stresses in Ta, Mo, Al and Pd Thin Films Deposited by E‐Beam Evaporation Process on Si and Si/SiO2 Substrates
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/content/aip/proceeding/aipcp/10.1063/1.2173565
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/content/aip/proceeding/aipcp/10.1063/1.2173565
2006-02-07
2016-05-30

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229c8a00d8fe88cf152414eb5d9cd803 conferences.conference_paperzxybnytfddd
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