MULTI‐LAYER STRUCTURE DESIGN AND SIMULATION FOR AU NANOROD ASSEMBLY
- Conference date: 18–20 July 2008
- Location: Chiangmai (Thailand)
This paper reports the results of the multi‐layer structure design and simulation for Au nanorod assembly. The multi‐layer structure is designed by simulation and fabricated using semiconductors. In the experiment, the dielectrophoresis (DEP) principle is used to assemble Au nanorods which are synthesized by electrochemical deposition (ECD). To increase the Au nanorod assembly efficiency, only first layer’s structure and multi‐layer’s structure are proposed by ANSYS simulation. Assembly efficiency of the first layer experiment is about 20% and assembly efficiency of multi‐layer experiment is improved by 45%. As a result, the Au nanorod assembly efficiency of forr the multi‐layer is increased by about 25% more than the assembly efficiency of only 1st layer.
- Semiconductor device fabrication
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