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Mechanical Failure of Thin Ta and Cu/Ta Layers on Polyimide Substrates: A Synchrotron‐Based Technique for In Situ Characterization
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/content/aip/proceeding/aipcp/10.1063/1.3169250
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.3169250
/content/aip/proceeding/aipcp/10.1063/1.3169250
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/content/aip/proceeding/aipcp/10.1063/1.3169250
2009-06-18
2016-06-29

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229c8a00d8fe88cf152414eb5d9cd803 conferences.conference_paperzxybnytfddd
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