fibDAC Stress Relief—A Novel Stress Measurement Approach For BEoL Structures
- Conference date: 12–14 April 2010
- Location: Bad Schandau, (Germany)
fibDAC stress relief is a new method developed to measure stresses on micro and nanotechnology devices. Focused Ion Beam (FIB) milling is used to remove locally material and release this way stresses. Cross correlation algorithms on high resolution SEM images captured before and after ion milling reveal stress relief deformations. Their analysis allows computation of stresses present at the place of ion milling. Thorough qualification of the approach resulted in a stress measurement accuracy of where E is the Young’s modulus of the material tested. Lateral resolution of stresses can be reduced to a value around 200 … 500 nm.
- Focused ion beam technology
- Materials analysis
- Scanning electron microscopy
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Y. K. Semertzidis, M. Aoki, M. Auzinsh, V. Balakin, A. Bazhan, G. W. Bennett, R. M. Carey, P. Cushman, P. T. Debevec, A. Dudnikov, F. J. M. Farley, D. W. Hertzog, M. Iwasaki, K. Jungmann, D. Kawall, B. Khazin, I. B. Khriplovich, B. Kirk, Y. Kuno, D. M. Lazarus, L. B. Leipuner, V. Logashenko, K. R. Lynch, W. J. Marciano, R. McNabb, W. Meng, J. P. Miller, W. M. Morse, C. J. G. Onderwater, Y. F. Orlov, C. S. Ozben, R. Prigl, S. Rescia, B. L. Roberts, N. Shafer‐Ray, A. Silenko, E. J. Stephenson, K. Yoshimura and EDM Collaboration
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