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Improvement of Poly Profile in Sub 30 nm Device By Damage Engineering and Tilted Implantation Method
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10.1063/1.3548439
/content/aip/proceeding/aipcp/10.1063/1.3548439
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.3548439
/content/aip/proceeding/aipcp/10.1063/1.3548439
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/content/aip/proceeding/aipcp/10.1063/1.3548439
2011-01-07
2015-02-27
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229c8a00d8fe88cf152414eb5d9cd803 conferences.conference_paperzxybnytfddd
Scitation: Improvement of Poly Profile in Sub 30 nm Device By Damage Engineering and Tilted Implantation Method
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/10.1063/1.3548439
10.1063/1.3548439
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