AN ULTRASONIC MODEL FOR REVEALING ELECTRONIC PACKAGE’S INNER STRUCTURE USING ACOUSTIC IMPEDANCE
- Conference date: 18–23 July 2010
- Location: San Diego, California, (USA)
The reflected ultrasonic echo’s amplitude is relative to the sample material’s acoustic impedance change. So the distribution of acoustic impedance is correlated with the inner structure. In this paper, an ultrasonic model is suggested to reveal electronic package’s inner structure using acoustic impedance. The model first reconstructs the impedance profile of layered medium through an incidence point, then gets other position’s impedance by moving the transducer regularly. Finally, the inner structure of the package can be revealed by the 3D image formed with the impedance matrix.
- Acoustic impedance
- Acoustic modeling
- Ultrasonic transducers
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Y. K. Semertzidis, M. Aoki, M. Auzinsh, V. Balakin, A. Bazhan, G. W. Bennett, R. M. Carey, P. Cushman, P. T. Debevec, A. Dudnikov, F. J. M. Farley, D. W. Hertzog, M. Iwasaki, K. Jungmann, D. Kawall, B. Khazin, I. B. Khriplovich, B. Kirk, Y. Kuno, D. M. Lazarus, L. B. Leipuner, V. Logashenko, K. R. Lynch, W. J. Marciano, R. McNabb, W. Meng, J. P. Miller, W. M. Morse, C. J. G. Onderwater, Y. F. Orlov, C. S. Ozben, R. Prigl, S. Rescia, B. L. Roberts, N. Shafer‐Ray, A. Silenko, E. J. Stephenson, K. Yoshimura and EDM Collaboration
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