- Conference date: 23-27 March 1998
- Location: Gaithersburg, Maryland (USA)
Challenging requirements have to be met by metrology tools for 300 mm wafers and technology generations ⩽0.25 μm in near future. Measurement equipment for some specific wafer parameters presently operates already at its limits and will not be able to meet the future requirements. New tools therefore were or are currently developed. The future requirements are outlined and examples for new approaches are presented. New geometry measurement tools and scanning surface inspection systems are available now and their performance is encouraging. Repeatability of less than 10 nm (1 sigma) for flatness measurement is obtained by a transmitted light interferometer. The sensitivity of surface inspection tools has been improved to detect surface flaws <100 nmLSE and these tools allow to distinguish between particles and other surface defects. The results presented provide also an impression about the state of development of 300 mm wafers.
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