- Conference date: 23-27 March 1998
- Location: Gaithersburg, Maryland (USA)
Construction of IC lines using 300 mm wafers will begin in 1998–99 for pilot lines, with construction of mass production lines in 2000 or later. These lines will most likely be introduced with design rules in the range from 250 to 180 nm. Difficult challenges for these feature sizes include critical dimensions, registration, thin film measurement, and defect inspection. At the same time, metrology is expected to play a major role in controlling costs, increasing manufacturing flexibility, and decreasing cycle time in addition to assisting in the reduced emission of global warming gases.
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