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STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias

  • Conference date: March 16, 2010 - July 13, 2010 - October 20, 2010
  • Location: Albany, NY, USA - San Francisco, CA, USA - Dresden, Germany
  • ISBN: 978-0-7354-0938-5
  • Editors: Ehrenfried Zschech , Riko Radojcic , Valeriy Sukharev  and Larry Smith
  • Volume number: 1378
  • Published: 12 September 2011
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1dd066124a513eff08aad5ba332a2e41 conferences.conference_proceedingszxybnytfddd
Scitation: STRESS MANAGEMENT FOR 3D ICS USING THROUGH SILICON VIAS: International Workshop on Stress Management for 3D ICs Using Through Silicon Vias
http://aip.metastore.ingenta.com/content/aip/proceeding/aipcp/1378
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