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Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing and as additive gases
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10.1116/1.582199
/content/avs/journal/jvsta/18/2/10.1116/1.582199
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/18/2/10.1116/1.582199
/content/avs/journal/jvsta/18/2/10.1116/1.582199
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/content/avs/journal/jvsta/18/2/10.1116/1.582199
2000-03-01
2014-07-23
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Inductively coupled, point-of-use plasma abatement of perfluorinated compounds and hydrofluorinated compounds from etch processes utilizing O2 and H2O as additive gases
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/18/2/10.1116/1.582199
10.1116/1.582199
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