Wettability and thermal stability of fluorocarbon films deposited by deep reactive ion etching
Dynamic contact angle of ethylene glycol on fluorocarbon film TE09 and base diameter of the droplet as a function of time.
Deposition rate as a function of gas flow. Coil power is , platen power is , deposition temperature is , and base pressure is .
Deposition rate as a function of coil power. flow rate is , platen power is , deposition temperature is , and base pressure is .
Static water contact angles and surface energies of some common used MEMS materials and the fluorocarbon film.
AFM images of the fluorocarbon film (a) TE10, (b) TE02, and (c) TE09.
(a) Static contact angles and (b) surface energy of the fluorocarbon film TE02 annealed at various temperatures in air for .
(a) Static contact angles and (b) surface energy of the three fluorocarbon films as a function of annealing temperature. Annealing time is , in air.
(a) Static water contact angles and thickness of fluorocarbon film TE02, and (b) decomposition rates of the three films as a function of annealing temperatures. Annealing time is , in air.
Surface tension of four test liquids (Ref. 10).
Thickness, contact angle , and surface energies of three fluorocarbon films.
Thickness and roughness of three fluorocarbon films chosen.
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