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Fabrication of a Cu nanodot array based on electroless plating employing a diblock copolymer nanotemplate
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10.1116/1.1885023
/content/avs/journal/jvsta/23/4/10.1116/1.1885023
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/23/4/10.1116/1.1885023
View: Figures

Figures

Image of FIG. 1.
FIG. 1.

Schematic illustration of our experimental procedure: (a) spin-coated diblock copolymer film on the substrate surface; (b) after annealing of the diblock copolymer film at ; (c) after VUV irradiation for at ; (d) AHAPS-organosilane film prepared on both the nanopore and PS regions; (e) after toluene treatment for ; (f) immobilization of Pd(II) particles onto the AHAPS-film on the nanopore regions; and (g) after area-selective electroless plating of Cu.

Image of FIG. 2.
FIG. 2.

AFM images of the diblock copolymer film before VUV irradiation: (a) topographic image and (b) phase image.

Image of FIG. 3.
FIG. 3.

AFM images of the diblock copolymer film after VUV irradiation: (a) after and (b) after .

Image of FIG. 4.
FIG. 4.

AFM images of the fabricated Cu nanodots: (a) two-dimensional image and (b) three-dimensional image.

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/content/avs/journal/jvsta/23/4/10.1116/1.1885023
2005-06-28
2014-04-18
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Fabrication of a Cu nanodot array based on electroless plating employing a diblock copolymer nanotemplate
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/23/4/10.1116/1.1885023
10.1116/1.1885023
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