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Adhesion properties of polymer/silicon interfaces for biological micro-/nanoelectromechanical systems applications
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10.1116/1.2435390
/content/avs/journal/jvsta/25/4/10.1116/1.2435390
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/25/4/10.1116/1.2435390

Figures

Image of FIG. 1.
FIG. 1.

SEM image of a polystyrene-based cell force sensor.

Image of FIG. 2.
FIG. 2.

SEM image of an SU8-based microgripper (from Ref. 18).

Image of FIG. 3.
FIG. 3.

Schematic of the polymer microstrip fabrication process: (i) PDMS mold, (ii) PDMS mold after spin coating with polymer (PS), (iii) mold applied to heated glass slide to remove excess polymer, (iv) excess polymer transferred to glass slide, (v) PDMS mold after removal of excess polymer, (vi) PDMS mold is applied to silicon substrate with heat and pressure, and (vii) microstrips are transferred to the silicon substrate.

Image of FIG. 4.
FIG. 4.

Hardness and elastic modulus of (a) thick PS and (b) thick SU8 films as a function of contact depth. Indents were performed at 22, 50, and .

Image of FIG. 5.
FIG. 5.

Load-displacement plots, AFM images, and height profile across the center of indents into (a) 7100, 870, 300, and thick PS and (b) 7400, 1470, 440, and thick SU8 films.

Image of FIG. 6.
FIG. 6.

Load-displacement plots, AFM images, and height profile across the center of indents into the (a) thick PS and (b) thick SU8 films taken at 22, 50, and .

Image of FIG. 7.
FIG. 7.

SEM image of delamination for thick PS and thick SU8 films.

Image of FIG. 8.
FIG. 8.

Schematic of the stages of the indentation-induced delamination for a film-substrate system (modified from Ref. 35).

Image of FIG. 9.
FIG. 9.

Load-displacement plots and SEM image of PS and SU8 microstrips.

Tables

Generic image for table
TABLE I.

Summary of the physical properties of PS and SU8.

Generic image for table
TABLE II.

Summary of measured interfacial adhesion energies as a function of film thickness for PS and SU8 at room temperature.

Generic image for table
TABLE III.

Summary of measured interfacial adhesion energies as a function of temperature for PS and SU8 films.

Generic image for table
TABLE IV.

Summary of measured interfacial adhesion energies as a function of thickness for PS and SU8 microstrips.

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/content/avs/journal/jvsta/25/4/10.1116/1.2435390
2007-07-03
2014-04-20
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Adhesion properties of polymer/silicon interfaces for biological micro-/nanoelectromechanical systems applications
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/25/4/10.1116/1.2435390
10.1116/1.2435390
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