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Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
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10.1116/1.2949233
/content/avs/journal/jvsta/26/5/10.1116/1.2949233
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/26/5/10.1116/1.2949233
/content/avs/journal/jvsta/26/5/10.1116/1.2949233
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/content/avs/journal/jvsta/26/5/10.1116/1.2949233
2008-07-30
2014-07-26
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752b84549af89a08dbdd7fdb8b9568b5 journal.articlezxybnytfddd
Scitation: Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy
http://aip.metastore.ingenta.com/content/avs/journal/jvsta/26/5/10.1116/1.2949233
10.1116/1.2949233
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