TEM cross section of via1s at failing via 1 structure.
(Color online) Schematic representation of the single-via analysis technique.
TEM cross section of via 1 showing the cured via bottom.
SEM image of the failing via 1 before Auger depth profile.
(Color online) Auger depth profile of the failing via 1 after FIB sample preparation.
SEM image of via 1 from good sample after FIB plan-view cut.
(Color online) Auger depth profile of the good via 1 after novel FIB sample preparation.
(Color online) EDS, cross sectional TEM, and top down SEM analyses of the trapped materials inside the via hole after etch and clean.
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