(Color online) (a) Intrinsic stress. The red open-square data represents the maximum stress reported in other studies (Refs. 2 , 19–23 ) for ta-C films deposited by different techniques and experimental setup. (b) Density, which was determined by RBS, and the C-sp3 fraction estimated using the model described in Ref. 25 . (c) Hardness of the ta-C films as a function of the substrate bias voltage. The dashed lines in (a) are only a guide to the eyes, while in (b) and (c) the dashed and dotted lines represent the mean values and the standard deviations, respectively.
(Color online) (a) Visible (514.5 nm) and (b) ultraviolet (275.4 nm) Raman spectra of a ta-C film as a function of the postannealing temperature.
(Color online) (a) Visible (514.5 nm) and (b) ultraviolet (275.4 nm) Raman deconvolution example from the as-deposited −150 V film. In this work, we adopted Gaussian contributions to all centers and a χ2 quality criterion higher than 99% to all spectra.
(Color online) (a) IT/IG and ID/IG ratios, (b) FWHM of the G-peak, (c) G-peak position, and (d) displacement of a ta-C film (deposited at −150 V of substrate bias voltage) as a function of the postannealing temperature.
(Color online) Contact angle of sessile deionized water drops on the surface of ta-C films as a function of the substrate bias voltage. The inset shows a schematic of how the angles are measured and two optical micrographs of water drops in the extreme conditions.
(Color online) Density of ta-C films deposited by FCVA and simultaneously bombarded with Ar+ ions in the range of 0–180 eV.
(Color online) Ar effusions of ta-C(Ar) films deposited by FCVA and simultaneously bombarded with three different Ar+ energies as a function of the postannealing temperature. All of the spectra are normalized by the thicknesses of the films.
(Color online) Stress of a ta-C(Ar) (square) film as a function of thepostdeposition annealing temperature. Data from Ref. 42 (triangle) for a ta-C film are also included for the sake of comparison.
Technique and the main experimental parameters applied on the deposition of the ta-C(:H) films cited in the Fig. 1(a) .
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