(Color online) (a) Cold-weld sealing with copper crimping and vacuum setup. (b) Photograph and (c) cutaway illustration of a minicell with copper plated indium solder seal.
(Color online) Experimental (blue stars) vs theoretical spectrum (purple solid line) of the 87Rb F = 1 transition for (a) a “dying” epoxy minicell and (b) a long-lasting copper-coated indium minicell. The residual sum of squares are 4.37 × 10−4 and 1.33 × 10−3 for (a) and (b), respectively. The main source of error in these fits is due to vapor cell temperature monitoring limitations in our system.
(a) Observed days to failure (average) for tested minicells by material type [epoxy(E), Sn/Pb, In, Cu plated Sn/Pb(Cu-Sn/Pb), and Cu plated In(Cu-In)] and temperature. (b) Ea and A constants [see Eq. (1) ] for minicells with measureable failure times.
(Color online) Voigt profile FWHM linewidth vs time for copper plated indium (blue diamonds), epoxy (red squares), and lead-tin (green triangles) minicells. These minicells were stored at 95 °C and optically tested at 46 °C.
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