(Color online) X-ray diffraction patterns of Ti–B–C–N–Si films deposited on AISI 304 stainless steel substrates with different silicon contents.
(Color) XPS spectra of (a) Ti 2p, (b) B 1s, (c) C 1s, (d) N 1s, (e) Si 2p, and (f) O 1s for Ti–B–C–N–Si(5 at. %) film.
(a) Bright field TEM image and (b) corresponding SADP obtained from the Ti–B–C–N–Si(5 at. %) film sample.
(Color online) (a) High resolution TEM image obtained from Ti–B–C–N–Si(5 at. %) film and (b) corresponding IFFT image calculated by Micrograph Gartan software.
(Color online) Three-dimensional AFM surface morphologies and their surface roughness of (a) Ti–B–C–N and (b) Ti–B–C–N–Si(5 at. %) film deposited on silicon wafer substrate.
(Color) Schematic illustration of Ti–B–C–N–Si [nc–(Ti,C,N)B2/nc-Ti(C,N)/nc-TiSi2/a–BNx/a–SiOx/a–BOx/a–TiOx/a–SiC/etc.] nanocomposite based on XRD, XPS, TEM, and AFM analyses.
(Color online) Nanohardness (H), Young's modulus (E), elastic recovery (We), H/E ratio, and residual stress of Ti–B–C–N–Si films with different content of silicon.
Typical deposition conditions of Ti–B–C–N–Si films deposited by the d.c. unbalanced magnetron sputtering.
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